High temperature co-fired ceramic

          High temperature co-fired ceramic (HTCC) is a multi-layer packaging technology for the electronics industry, used in military electronics, MEMS, microprocessor and RF applications.HTCC packages generally consist of multilayers of alumina oxide with tungsten and molymanganese metalization. 
          The ceramic is fired at around 1600 degrees Celsius, which is significantly higher than a similar technology Low temperature co-fired ceramic, or LTCC. Compared to LTCC, HTCC has higher resistance conductive layers.
 Advantages of HTCC includes mechanical rigidity and hermeticity, both of which are important in high-reliability and environmentally stressful applications. Another advantage is HTCC's thermal dissipation capability, which makes this a microprocessor packaging choice, especially for higher performance processors.